socket board
반도체 Device 신뢰성 검증을 위한 Direct Contact Test 공법
| Size | 80mm X 125mm |
| Layer | 8L ~ 20L |
| Material | FR-5 (HI-TG), Polyimide |
| Thickness | 1.6mm ~ 2.4mm |
| Fine Pitch | 0.3mm ~ 0.8mm |
| Min.Hole | 0.1mm |
| Surface Treatment | ENIG |
| Option | HPL |
socket board
반도체 Device 신뢰성 검증을 위한 Direct Contact Test 공법
| Size | 70mm X 85mm |
| Layer | 8L ~ 20L |
| Material | FR-5 (HI-TG), Polyimide |
| Thickness | 1.6mm ~ 2.4mm |
| Fine Pitch | 0.3mm ~ 0.8mm |
| Min.Hole | 0.1mm |
| Surface Treatment | ENIG |
| Option | HPL |